Sony is reportedly working on to bring new Xperia devices into the market. Japanese company has three new smartphones in the pipeline and all of them are expected to unveil at Mobile World Congress to be held in February, 2018. A Sony Xperia with model number H8266 has been spotted at GeekBench database and it will sport latest in the house, Qualcomm Snapdragon 845 SoC. This new device will probably be the successor of previously launched Xperia XZ1 and XZ1 Compact.
Previous leaks suggests that Sony is ready to unveil three new Xperias, probably the successors of previously launched devices. Sony H81xx should be sequel to much famous Xperia XZ Premium flagship, Sony H82xx should follow up on the Xperia XZs while third one, H8266 will be upgraded variant of Xperia XZ1 smartphone. These smartphones are expected to release in early 2018.
Sony H8266 – confirmed to pack Snapdragon 845, 4GB RAM and android oreo | Credit : GeekBench
Sony H8266 GeekBench database reveals that device will run Android 8.0 Oreo and Snapdragon 845 octa-core processor clocked at 1.77GHz that is coupled with 4GB RAM. The listing further unfolds the performance score of device, it achieved a scintillating 2393 single core score and 8300 score for multi-cores. These scores matched Galaxy S9+’s score with same chipset. This whooping score confirms that Qualcomm Snapdragon 845 will take smartphones towards smoothness in terms of performance.
No other information is revealed through the listing. But rumored sources suggests that New Xperia will pack dual 12 mega-pixel camera on the back and 15 mega-pixel selfie shooter. It is expected to pack atleast 64GB internal storage and a 3130 mAH battery. Another point that needs here to be highlighted is Sony decided to move on to bezel-less displays sporting 18:9 aspect ratio displays instead of traditional 16:9 displays.
New Sony Xperia (out of three) is said to bear these model numbers – the H8216, also known as H8266, H8276 and H8296 (according to different countries.
Source : GeekBench